Semiconductor - Green Industrial (Ubushinwa) Co, Ltd.

Gusaba mu nganda za Semiconductor

GREEN ni ikigo cyigihugu cyubuhanga buhanitse cyahariwe R&D nogukora ibikoresho bya elegitoroniki byikora hamwe nibikoresho bipfunyika & semiconductor. Gukorera abayobozi binganda nka BYD, Foxconn, TDK, SMIC, Solar yo muri Kanada, Midea, nibindi 20+ nibindi bigo bya Fortune Global 500. Umufatanyabikorwa wawe wizewe kubisubizo byiterambere byiterambere.

Imashini zihuza zituma mikoro ihuza imiyoboro ya diametre, ikemeza ibimenyetso byuzuye; acide formic acide vacuum ifata ingingo zizewe munsi ya ogisijeni <10ppm, ikarinda kunanirwa kwa okiside mubipfunyika cyane; AOI ihagarika inenge ya micron. Ubu bufatanye butuma> 99,95% byongera umusaruro wapakira, byujuje ibisabwa bikabije bya 5G / AI.

Kohereza iperereza

Porogaramu ya Wire Bonders munganda za Semiconductor

Ultrasonic Wire Bonder

Irashobora guhuza insinga ya aluminium 100 μm - 500 μm, insinga z'umuringa 200 μm - 500 μm, ibyuma bya aluminiyumu bigera kuri 2000 mm z'ubugari na 300 mm z'ubugari, hamwe n'imyenda y'umuringa.

https://www.machine-icyatsi.com/wire-bonder/

Urugendo: 300 mm × 300 mm, 300 mm × 800 mm (birashoboka), hamwe no gusubiramo <± 3 μm

Urugendo: 100 mm × 100 mm, hamwe no gusubiramo <± 3 μ m

Ikoranabuhanga rya Bonding Technology ni iki?

Guhuza insinga ni tekinike ya microelectronic ihuza imiyoboro ikoreshwa muguhuza ibikoresho bya semiconductor kubipfunyika cyangwa substrate. Nka bumwe mu buhanga bukomeye mu nganda za semiconductor, butuma chip ihuza imiyoboro yo hanze mubikoresho bya elegitoroniki.

Guhuza ibikoresho

1. Aluminium (Al)

Amashanyarazi arenze urugero na zahabu, birahendutse

2. Umuringa (Cu)

25% hejuru yumuriro w'amashanyarazi / ubushyuhe burenze Au

3. Zahabu (Au)

Inzira nziza, kurwanya ruswa, no guhuza kwizerwa

4. Ifeza (Ag)

Umuyoboro mwinshi mu byuma

Aluminium

Agasanduku ka Aluminium

Umuringa

Agasanduku k'umuringa

Kohereza iperereza

Porogaramu ya AOI muri Semicon Gupfa / Guhuza insinga

Semiconductor Die Bonding & Wire Bonding AOI

Koresha kamera ya megapixel ya megapixel 25 kugirango umenye inenge zipfa no guhuza insinga kubicuruzwa nka IC, IGBTs, MOSFETs, hamwe na frame ikora, bigera ku gipimo cyo kumenya inenge kirenze 99.9%.

Imanza z'Ubugenzuzi

Irashobora kugenzura uburebure bwa chip nuburinganire, chip offset, kugorama, no gukata; umupira wo kugurisha udafatanye hamwe nuwagurishije hamwe; Inenge zihuza insinga zirimo uburebure bukabije cyangwa budahagije, gusenyuka kuzunguruka, insinga zacitse, insinga zabuze, guhuza insinga, kugoreka insinga, kwambukiranya imirongo, n'uburebure bukabije bwumurizo; ibifunga bidahagije; n'icyuma.

Umupira wo kugurisha / Ibisigisigi

Igishushanyo cya Chip

Gushyira Chip, Igipimo, Ibipimo

Kwanduza Chip / Ibikoresho byo hanze

Gukata

Umuyoboro wa Ceramic

AMB Oxidation

Kohereza iperereza

Porogaramu yaifuru ya aside irike mu nganda za Semiconductor

Mumurongo wa Acide Yerekana Ifuru

Sisitemu igabanijwemo: sisitemu yo gutwara abantu, gushyushya / kugurisha, agace ka vacuum, zone ikonje, hamwe na sisitemu yo kugarura rosin

https://www.machine-icyatsi.com/ibiganiro-us/

1. Ubushyuhe ntarengwa ≥ 450 ° C level urwego ntarengwa rwa vacuum <5 Pa

2. Gushyigikira aside irike hamwe na azote itunganya ibidukikije

3. Igipimo cyingingo imwe yubusa ≦ 1%, igipimo cyubusa muri rusange ≦ 2%

4. Gukonjesha amazi + gukonjesha azote, ifite sisitemu yo gukonjesha amazi no gukonjesha

Imashanyarazi ya IGBT

Igipimo cyinshi cyo guta agaciro mu kugurisha IGBT kirashobora gukurura kunanirwa-reaction harimo guhunga ubushyuhe, gucika imashini, no kwangirika kwamashanyarazi. Kugabanya ibiciro bidafite agaciro kuri ≤1% byongera cyane ibikoresho byiringirwa no gukoresha ingufu.